Footprint Change List

Footprint Change List

DateDescription
25-Apr-2008 Added footprint for solder jumpers JMP_SLDR-2N.fp and JMP_SLDR-3N.fp
Added footprint for the New Haven LCD NHD-0220AU-FSW-FTS
Added footprint for the CUI PJ-202AH CON__CUI_PJ-202AH.fp
The footprint for the Max Stream XBee PRO was mistakenly named MOD__MaxStream_XBee.fp. It has been renamed MOD__MaxStream_XBee_PRO.fp.
Added SSOP-65P-780L1-28N__LTC_G_Package.fp
Added footprints for Phoenix COMBICON compact headers PT 1,5/xx-PVH-3,5
Corrected the silkscreen body on AMP 102979 and 103149 series connectors. The outside edge of the body is 140mils from the center of the first pin row. I mistakenly set the inside edge of the body to 140mils.
27-Mar-2008 Added footprint for API Delevan 1025 Molded Unshielded RF Coils IND-1016P-635L-241D__API-Delevan_1025.fp
Added footprint for the MaxStream XBee module MOD__MaxStream_XBee.fp
Added footprints for 3mm, 4mm, and 5mm LEDs using the Kingbright specifications. LED_T175 has been replaced with LED-254P-580D__Kingbright_5mm.fp
Added footprints for 6 position jumper JMP-254P-254Sr-6N.fp
Added footprints for the Sullins LJB series header receptacles (dual row, right angle, thru-hole, 100mil centers).
Added footprints for AMP 102979 and 103149 series header connectors, dual row, right angle, thru-hole, 100mil centers)
13-Feb-2008 Replaced the footprints for the Panasonic EF Series tantalum capacitors cap-tant-Panasonic-EF--*. The silkscreen clearance should now be 10mils on all the footprints. The symlinks that link Panasonic part numbers to the corresponding footprint file have been removed.
Replaced the Panasonic UP TS Series capacitors. The new footprint names do not specify a body length or pin diameter.
Added the Kemet Ultradip-II Tantalum T350, T353, T354 and T355 Series capacitors. The body sizes are the same between the series, the pin spacings are different.
Pin SpacingSeries
100mil T350, T351
125mil T355
200mil T352, T353, T356
250mil T354
Added AVX TAP Series Capacitors
Replaced the footprints for the Panasonic M Series electrolytic capacitors cap-elec-Panasonic-M--*. The symlinks that link Panasonic part number to the corresponding footprint file have been removed.
There was a mistake in the footprint names for the component groups --- RESCAX RESCAV RES CAPPR CAPR JMP. The underscore following the component group name has been changed to a hyphen.
Added DO-15.fp, DO-35.fp, DO-41.fp
Added footprint for Switchcraft right-angle 1/4" phone jack CON__Switchcraft_RN-Series.fp
Removed the footprint semi-BJT-TO-92-EBC. This is a TO-92 with the pins labeled "E", "B" and "C"
Created new footprints for the Kemet Ceramic "Golden Max" Capacitors
Case Footprint
C315
new CAPR_254P-254W-380L-533H__Kemet_315.fp
old cap-cer-Kemet-goldenmax--L150-W100-P100-mils
C317
new CAPR_508P-254W-380L-584H__Kemet_317.fp
old cap-cer-Kemet-goldenmax--L150-W100-P200-mils
C320
new CAPR_254P-317W-508L-660H__Kemet_320.fp
old cap-cer-Kemet-goldenmax--L200-W125-P100-mils
C322
new CAPR_508P-317W-508L-660H__Kemet_322.fp
old cap-cer-Kemet-goldenmax--L200-W125-P200-mils
C323
new CAPR_508P-317W-508L-812H__Kemet_323.fp
C330
new CAPR_508P-380W-761L-914H__Kemet_330.fp
old cap-cer-Kemet-goldenmax--L300-W150-P200-mils
C333
new CAPR_508P-380W-761L-990H__Kemet_333.fp
C340
new CAPR_508P-380W-1016L-1168H__Kemet_340.fp
old cap-cer-Kemet-goldenmax--L400-W150-P200-mils
C350
newCAPR_1016P-508W-1270L-1422H__Kemet_350.fp
oldcap-cer-Kemet-goldenmax--L500-W200-P400-mils
27-Jan-2008 Fixed the soldermask clearance in the Yageo resistor footprints
26-Jan-2008 Added Yageo metal film thru-hole resistors, M-Series (preformed)
Added Yageo metal film thru-hole resistors, MFR-Series
Added Yageo metal film thru-hole resistors, MR-Series (preformed)
Removed res-carbon-film-Panasonic-ERD-0W25--P10.16-mm
Possible substitute --- RES_1016P-630L-240D__Yageo-MFR-25.fp.
Removed res-carbon-film-Panasonic-ERD-0W50--P10.16-mm
Possible substitutes --- RES_1270P-900L-330D__Yageo-MFR-50.fp or RES_1016P-630L-240D__Yageo-MFR-25.fp
27-Aug-2007 Corrected the soldermask and clearance values for the RESCAV and RESCAX series components.
6-Aug-2007 New footprint files will have an .fp extension
New stencil footprint files will have an .sfp extension
Added footprints for TI DRB, DRC and DRV packages.
  • DRC --- TPS61081 datasheet (January 2007)
  • DRB --- TPS61062 datasheet (April 2005)
  • DRV --- TPS79930 datasheet (May 2007)
Added stencil footprint defined in TPS6120x Datasheet (June 2007).
15-Apr-2007 Changed the pinout of the Hirose DF9 plugs to match DSUB and SCSI connectors (the sockets already match). The Hirose drawings do not define the pinout.
24-Feb-2007 Added CTS resistor networks series 740, 741, 742, 743, 744, 745, 746,
Added Molex EBBI connectors 71661 Series. See Molex drawing SDA-71661-2*** Rev. M for mounting information.
Fixed the silkscreen on the Molex 68301 header footprints. For the headers with an odd number of pins a silkscreen line went over the last pad.
Corrected the mounting hole pin number in the Tyco 215079 Micromatch connector footprints. The mounting hole pin number was the same as the last electrical pin.
14-Feb-2007 Added POT__Bourns_3006P-Series and POT__Bourns_3299W-Series
Added CON_USB_MINI_B__Molex_67503-1020
N.B. The drawing, SD-67503-010, has two pads with no clearance to the PCB edge. I reduced the length of each of these pads by 25mils and shifted the pad centers to provide 25mils of clearance. The symbol should be placed so that the mark is on the edge of the PCB. The hashed rectangle defines the pattern restricted area.
18-Jan-2007 Added footprint for Abracon AWCR Resonators
Added folded dipole antenna from Chipcon Design Note DN004 (document number SWRA118 dated 2006). The antenna is made using multiple overlapping pads. The PCB in the design note has solder-mask over the antenna so I set the mask clearance of each pad to 0.
Added footprint for Micro Crystal Switzerland MS1V-T1k Crystal
Added footprints for Molex 68301 series SMT single row headers
Added LQFP-80P-970L1-970-32N__Philips
Replaced LQFP64-10x10-64_Philips with LQFP-50P-1330L1-1330L2-64N__Philips. The replacement corrects a silkscreen spacing error.
When changing the mounting holes to pins in footprint CON_USB_TYPEB__Keystone_924 I forgot to remove the silkscreen arc around the holes and change the pad diameter. This has been fixed.
Added photointerrupters OPTO__Fairchild_MOC70Px and OPTO__Sharp_GP1S094HCZ
Added Johnson SMA connectors CON__Johnson_142-0701-801, CON__Johnson_142-0701-851, CON__Johnson_142-0701-871, CON__Johnson_142-0701-881, CON__Johnson_142-0711-821, CON__Johnson_142-0711-871, CON__Johnson_142-0711-881
Added TSSOP-50P-2000L1-56N
Replaced OPTO-254P-1054L1-8N__Fairchild_6N138 with OPTO-254P-1030L1-8N__Fairchild_6N138. The replacement footprint has an increased pad row separation (apx 20mils), increased pad length, decreased width of the corner pads (the corner pins are narrow for Fairchild and Agilent parts) and a correct name.
18 December 2006 Changed the mounting holes to pins in footprint CON_USB_TYPEB__Keystone_924
Added Keystone AAA Battery Clips, part number 82. The footprint contains two clips spaced 1080 mils apart.
Added Keystone AA Battery Clips, part number 92. The footprint contains two clips spaced 1300 mils apart.
CON__CUI_PJ-002AH-SMT --- decreased the size of the alignment pin holes. The small pin is now 67mils, the large pin is now to 79mils.
Added TO263_170P_788L1_5N__National_TS5B_Package
Added SC70-65P-210L1-6N__On-Semi_419B-02-Package and SC70-65P-210L1-5N__On-Semi_419A-02-Package. The On-Semi pad length specification is 0.5mm compared to 1mm for the LTC SC70.
Added 3M 2mm x 2mm Pin Strip Headers 1512xx-8x2x-xx (straight)
Added 3M 2mm x 2mm Pin Strip Headers 1512xx-7x2x-xx (right angle)
Added 3M 2mm x 2mm Pin Strip Headers 1502xx-600x-xx (straight)
Added all Hirose DF9 Series 1mm pitch SMT Board to Board Connectors except the bottom entry header (DF9L-31P-1V).
Added Molex 71308 Dual Row, SMT, Vertical Header, 100 mil pitch with retention pegs.
Corrected pads on the JST BxB-PH-K headers. The solder-side pads are changed from pins to pins with rounded pads which now matches the component-side pads. The refdes is shifted 10mils from the body outline (it was apx 1-2mils).
Added CAPMP-1000P-1750W-4000L__Powerstor_FC-Series
29 September 2006Made the following changes to CON_USB_TYPEB__Keystone_924 --- (1) Corrected the pinout, (2) moved the refdes closer to the component edge, (2) changed the pad size from 70mils to 66 mils to increase the pad-to-pad spacing from apx. 7.5mils to apx. 11.5mils
20 August 2006Corrected the lead span (L1) in MSOP-50P-490L1-10N__ADI_RM-10_Package and MSOP-65P-490L1-8N__ADI_RM-8_Package
5 August 2006Added Johnson Component shielded test jacks (129-0701-20x and 129-0701-30x)
Added Tyco Micro-Match Connectors (series 215079)
Added footprints for C&K 7101SDAxx,7201SDAxx, 7101SDCxx, 7201SDCxx
Added footprints for Sumida CR75 Series Inductors
Added footprints for Bourns SDR0805 Series Inductors. N.B.The silkscreen on this part consists of two lines rather than a circle. The body diameter of this part is 7.8mm and the recommended pads consume an 8mm square. Rather than making a large circle (d>11.5mm) or short arcs I made two lines.
Added footprints for Coilcraft DC1012 Series Inductors.
Added footprints for Bourns Inductors SRU5028,SRU8028 and SRU8043
Added footprints for On-Semiconductor SOT363
Added footprints for
Fixed the DIP footprints
   1. Rounded pads are now on solder and component side
   2. Increased the silkscreen to copper separation from five mils to ten mils
Changed all of the mounting holes to pins in IND__Toko_10EZ-Series. Not all pin positions are populated for all varieties of the 10EZ Series. Also corrected the refdes position.